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文章詳情
瓶胚高速注塑干燥系統(tǒng)之四
日期：2026-01-31 23:50
瀏覽次數(shù)：2
摘要：瓶胚高速注塑干燥系統(tǒng)之四，PET瓶胚，PET干燥系統(tǒng)，PET干燥
瓶胚高速注塑干燥系統(tǒng)之四，PET瓶胚，PET干燥系統(tǒng)，PET干燥
2. 分級(jí)預(yù)結(jié)晶與定型防粘
環(huán)境空氣經(jīng)雙級(jí)過(guò)濾后進(jìn)入熱風(fēng)加熱器，加熱至 140~160℃后從結(jié)晶器底部布風(fēng)板均勻送入，形成穿流熱風(fēng)；結(jié)晶器內(nèi)的低速攪拌 / 振動(dòng)裝置使切片流化，與熱風(fēng)充分接觸，完成常溫→80~120℃預(yù)熱→140~160℃結(jié)晶的分級(jí)加熱。
Ambient air enters the hot air heater after double-stage filtration, is heated to 140~160℃ and then uniformly sent from the air distribution plate at the bottom of the crystallizer to form cross-flow hot air; the low-speed stirring/vibration device in the crystallizer fluidizes the chips to fully contact with the hot air, completing the graded heating of room temperature → 80~120℃ preheating → 140~160℃ crystallization.
切片分子鏈在熱激活下形成均勻微小晶核，結(jié)晶度從＜5% 提升至 25%~35%，實(shí)現(xiàn)物理定型，徹底避免后續(xù)高溫干燥時(shí)的粘連結(jié)塊；同時(shí)切片表面的游離水被熱風(fēng)脫附，完成初步脫水，熱風(fēng)閉環(huán)循環(huán)僅排出 5%~10% 含濕熱風(fēng)。
The molecular chains of the chips form uniform tiny crystal nuclei under thermal activation, and the crystallinity is increased from ＜5% to 25%~35% to realize physical shaping, completely avoiding adhesion and caking during subsequent high-temperature drying; at the same time, the free water on the chip surface is desorbed by hot air to complete preliminary dehydration, and the hot air closed loop only discharges 5%~10% of humid hot air.
3. 密閉輸送至干燥模塊
結(jié)晶度達(dá)標(biāo)的 PET 切片經(jīng)結(jié)晶器底部鎖氣閥排出，通過(guò)密閉螺旋輸送機(jī)直接輸送至除濕干燥模塊的干燥料斗頂部，全程密閉無(wú)外露，與環(huán)境空氣零接觸，徹底杜絕二次吸濕。
PET chips with qualified crystallinity are discharged through the air lock valve at the bottom of the crystallizer and directly conveyed to the top of the drying hopper of the dehumidification and drying module by an airtight screw conveyor, with the whole process airtight and no exposure, zero contact with ambient air, and completely eliminating secondary moisture absorption.
輸送管道包裹聚氨酯保溫層，防止切片溫度驟降導(dǎo)致分子鏈凍結(jié)，保證切片進(jìn)入干燥模塊時(shí)溫度穩(wěn)定在 140℃左右，降低干燥模塊的熱負(fù)荷。
The conveying pipeline is wrapped with a polyurethane insulation layer to prevent the molecular chain from freezing due to the sudden drop of chip temperature, ensure that the chip temperature is stable at about 140℃ when entering the drying module, and reduce the heat load of the drying module.
4. 高溫低露點(diǎn)深度除濕干燥
這是系統(tǒng)實(shí)現(xiàn)切片深度脫水的核心環(huán)節(jié)，環(huán)境空氣先進(jìn)入分子篩除濕機(jī)，雙塔 / 轉(zhuǎn)輪分子篩吸附水汽，將空氣露點(diǎn)穩(wěn)定降至 - 40℃~-70℃，形成極低露點(diǎn)干燥空氣。
This is the core link for the system to realize deep dehydration of chips. Ambient air first enters the molecular sieve dehumidifier, and the double-tower/rotary molecular sieve adsorbs water vapor to stably reduce the air dew point to -40℃~-70℃, forming extremely low dew point dry air.
低露點(diǎn)干燥空氣經(jīng)高溫不銹鋼加熱器升溫至 160~180℃，形成高溫低露點(diǎn)干燥熱風(fēng)，從干燥料斗底部向上強(qiáng)制吹送，與從頂部緩慢下落的切片形成逆流接觸，停留時(shí)間 4~6 小時(shí)。
The low dew point dry air is heated to 160~180℃ by a high temperature stainless steel heater to form high temperature and low dew point dry hot air, which is forcibly blown upward from the bottom of the drying hopper to form countercurrent contact with the chips slowly falling from the top, with a residence time of 4~6 hours.
高溫使切片內(nèi)部的結(jié)合水獲得能量向表面擴(kuò)散，極低露點(diǎn)的熱風(fēng)與切片表面形成巨大濕度差，快速吸附擴(kuò)散出的水分并隨熱風(fēng)帶走，*終將切片含水率降至≤20ppm，滿足瓶胚高速注塑的工藝要求。
High temperature enables the bound water inside the chips to gain energy and diffuse to the surface, and the hot air with extremely low dew point forms a huge humidity difference with the chip surface, quickly adsorbs the diffused water and takes it away with the hot air, and finally reduces the chip moisture content to ≤20ppm, meeting the process requirements of high-speed preform injection moulding.
5. 熱風(fēng)再生循環(huán)與節(jié)能
分子篩吸附水汽后會(huì)逐漸飽和，熱風(fēng)再生模塊通過(guò)再生加熱器將空氣加熱至 180~250℃，吹過(guò)飽和的分子篩，打破分子篩與水汽的吸附結(jié)合，將水汽脫附并隨廢風(fēng)排出，實(shí)現(xiàn)分子篩的再生。
The molecular sieve will gradually become saturated after adsorbing water vapor. The hot air regeneration module heats the air to 180~250℃ through a regeneration heater, blows it through the saturated molecular sieve, breaks the adsorption combination between the molecular sieve and water vapor, desorbs the water vapor and discharges it with waste air, realizing the regeneration of the molecular sieve.
雙塔分子篩采用一用一備、自動(dòng)切換模式，切換周期 10~15 分鐘，保證干燥熱風(fēng)無(wú)間斷供應(yīng)；轉(zhuǎn)輪分子篩則通過(guò)低速旋轉(zhuǎn)實(shí)現(xiàn)吸附、再生、冷卻的連續(xù)作業(yè)，熱風(fēng)利用率更高；系統(tǒng)同時(shí)回收再生廢風(fēng)的余熱，預(yù)熱進(jìn)入除濕機(jī)的常溫空氣，能耗降低 30% 以上。
The double-tower molecular sieve adopts the mode of one use and one standby, automatic switching with a switching cycle of 10~15 minutes to ensure the uninterrupted supply of dry hot air; the rotary molecular sieve realizes the continuous operation of adsorption, regeneration and cooling through low-speed rotation with higher hot air utilization rate; the system also recovers the waste heat of regenerated waste air to preheat the normal temperature air entering the dehumidifier, reducing energy consumption by more than 30%.
6. 成品密閉輸送與注塑聯(lián)動(dòng)
含水率達(dá)標(biāo)的干燥 PET 切片從干燥料斗底部排出，經(jīng)保溫真空上料機(jī)密閉輸送至瓶胚注塑機(jī)的保溫料斗，注塑機(jī)料斗配備料位傳感器，與干燥系統(tǒng)形成供料聯(lián)動(dòng)：注塑機(jī)料位低時(shí)，干燥系統(tǒng)提高供料速度；料位高時(shí)，暫停供料，保證供料與注塑產(chǎn)能精準(zhǔn)匹配。
The dried PET chips with qualified moisture content are discharged from the bottom of the drying hopper and conveyed airtightly to the thermal insulation hopper of the preform injection moulding machine by a thermal insulation vacuum feeder. The injection moulding machine hopper is equipped with a level sensor to form feeding interconnection with the drying system: when the injection moulding machine level is low, the drying system increases the feeding speed; when the level is high, feeding is suspended to ensure the precise matching of feeding and injection capacity.
全程輸送管道與料斗均做保溫處理，切片溫度穩(wěn)定在 160℃左右，避免溫度驟降導(dǎo)致切片吸濕，同時(shí)保證切片進(jìn)入注塑機(jī)料筒后熔融效率高，匹配高速注塑的高射速要求。
The whole conveying pipeline and hopper are insulated, and the chip temperature is stable at about 160℃ to avoid chip moisture absorption due to sudden temperature drop, and at the same time ensure high melting efficiency of the chips after entering the injection moulding machine barrel, matching the high injection speed requirement of high-speed injection moulding.
